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Micro USB connectors

MICRO USB 3.0 Poj niam, 10P SMD KLS1-234-10F3

Cov ntaub ntawv khoom siv: Lub tsev: LCP, UL94V-0 Hu rau: Copper Alloy. Kub Plating AT Contact Area Tin Plating on the Tails. Plhaub:SUS304.Tin Plated Hluav Taws Xob: Tiv tauj tam sim no ntsuas: 1.0A Max. Tiv tauj Resistance: 30m? Max. Rwb thaiv tsev Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Kev Ua Haujlwm Kub: -30 ° C ~ + 80 ° C. Mechanical Yam ntxwv: Mating Force: 3.5kgf Max. Unmating Force: 1.0kgf Min. Dura...

MICRO USB 3.0 Poj niam, 10P Vertical SMD KLS1-234-10F2

Cov ntaub ntawv khoom siv: Lub tsev: LCP, UL94V-0 Hu rau: Copper Alloy. Kub Plating AT Contact Area Tin Plating on the Tails. Plhaub:SUS304.Tin Plated Hluav Taws Xob: Tiv tauj tam sim no ntsuas: 1.5A Max. Tiv tauj Resistance: 30m? Max. Rwb thaiv tsev Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Kev Ua Haujlwm Kub: -20 ° C ~ + 60 ° C. Mechanical Yam ntxwv: Mating Force: 3.5kgf Max. Unmating Force: 1.0kgf Min. Dura...

MICRO USB 3.0 Poj niam, 10P SMD KLS1-234-10F1

Cov ntaub ntawv khoom siv: Lub tsev: LCP, UL94V-0 Hu rau: Copper Alloy. Kub Plating AT Contact Area Tin Plating on the Tails. Plhaub:SUS304.Tin Plated Hluav Taws Xob: Tiv tauj tam sim no ntsuas: 1.0A Max. Tiv tauj Resistance: 30m? Max. Rwb thaiv tsev Resistance: 100M? Min. Dielectric Withstanding Voltage: 100V AC RMS Kev Ua Haujlwm Kub: -30 ° C ~ + 80 ° C. Mechanical Yam ntxwv: Mating Force: 3.5kgf Max. Unmating Force: 1.0kgf Min. Dura...

MICRO USB 3.0 PLUG, 10P Solder KLS1-234-10M1

Cov ntaub ntawv khoom siv: Lub tsev: Thermoplastic, UL94V-0 Tiv tauj: tooj liab Alloy. Plhaub: SUS201. Plating: Sib cuag: Kub Plating Saib Table AT Contact Area Tin Plating AT Solder Area. Nickel nyob rau hauv plated tag nrho. Plhaub: Solder Nickel Plated Rau Txhua Tus. Hluav taws xob: Ua haujlwm kub: -20 ° C txog + 80 ° C. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Sijhawm Order

CONN PLUG MICRO USB HOM B Clip KLS1-236-5M8

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, UL94V-0 LCP, Dub. Hu rau: C2680 / C5191. Plhaub: Steel. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin Lead On Solder Talls. Plhaub: Tin Lead Plating. Hluav taws xob: Tiv tauj Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 50V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 100MΩ Min. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Sijhawm Order...

CONN PLUG MICRO USB HOM B CLIP L8.8 KLS1-236-5M7

Khoom Qhia Lub Tsev: Hing Kub Thermoplastic nrog gf, UL94V-0. Hu rau: Copper Alloy, t = 0.20mm. Plhaub: SUS, t = 0.20mm. Hluav taws xob: Tam sim no ntsuas: 1A Max. Dielectric Withstanding Voltage: 100V AC rau 1 min. Tiv tauj Resistance: 50mΩ Max. Rwb thaiv tsev Resistance: 100MΩ Min. Tag nrho Mating Force: 3.57 kgf Max. Tag Nrho Unmating Force: 1.0 kgf Min. Qhov kub thiab txias: -30 ° C mus txog +80 ° C Part No. Description PCS/CTN GW..

CONN PLUG MICRO USB HOM B CLIP L6.8 KLS1-236-5M6

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Kub Thermoplastic nrog gf, UL94V-0. Hu rau: Copper Alloy, t = 0.20mm. Plhaub: SUS, t = 0.20mm. Hluav taws xob: Tam sim no ntsuas: 1A Max. Dielectric Withstanding Voltage: 100V AC rau 1 min. Tiv tauj Resistance: 50mΩ Max. Rwb thaiv tsev Resistance: 100MΩ Min. Tag nrho Mating Force: 3.57 kgf Max. Tag Nrho Unmating Force: 1.0 kgf Min. Qhov kub thiab txias: -30 ° C mus txog +80 ° C Qhov No. Descripti...

CONN PLUG MICRO USB HOM B SMD KLS1-236-5M3

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, UL94V-0 LCP, Dub. Hu rau: C2680 / C5191. Plhaub: tooj liab / hlau / stainless hlau. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin Lead On Solder Talls. Plhaub: Tin Lead Plating. Hluav taws xob: Tiv tauj Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 50V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 100MΩ Min. Part No. Description PCS/CTN GW(KG) CMB(m3) Ord...

CONN PLUG MICRO USB HOM B SMD KLS1-236-5M2

Cov ntaub ntawv khoom siv: Lub tsev: Hing Temperature Yas, UL94V-0, Dub. Hu rau: C2680 / C5191. Plhaub: Tooj. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin Lead On Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tiv tauj Resistance: 30mΩ Max. Rwb thaiv tsev Resistance: 100MΩ Min. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Sijhawm Order

CONN PLUG MICRO USB HOM B PCB MID MOUNT KLS1-236-5M1

Cov Khoom Siv Khoom Siv Hauv Tsev: LCP, UL94V-0, Dub. Hu rau: tooj liab Alloy. Plhaub: SUS 304 T = 0.20. Xaus: Tiv tauj: Kub Plating ntawm thaj chaw tiv tauj. 80u" Sn Plating ntawm thaj tsam ntawm qhov muag. Hluav taws xob: Voltage Rating: 30VAC RMS. Kev ntsuas tam sim no: 2.0A (pin 1 5); 1.0A(pin 2 3 4). Tiv tauj Resistance: 50mΩ Max. Rwb thaiv tsev Resistance: 100MΩ Min. Dielectric Withstanding Voltage: 500V AC Rau ...

CONN PLUG MICRO USB Solder KLS1-235-5

Cov ntaub ntawv khoom siv: Lub tsev: LCP E130, UL94V-0 Dub Tiv tauj: tooj dag 5210. Plhaub: Stainless hlau, T = 0.20 ± 0.03mm. Plating: Hu rau: Plated Kub Flash Rau Chaw Sib cuag. Plhaub: Nickel Tshaj Tag Nrho (ntsev tshuaj tsuag rau 24H). Plhaub: Kub Txhuam (ntxuav tshuaj tsuag rau 24H). Hluav taws xob: Ua haujlwm kub: -20 ° C txog + 80 ° C. Khoom raws li qhov kev thov RoHS Tshooj No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Sijhawm Order

CONN PLUG MICRO USB HOM B Solder KLS1-235-3

Cov ntaub ntawv khoom siv: Lub tsev: LCP, UL94V-0 Dub. Hu rau: Phosphor Bronze, T = 0.20 ± 0.01mm. Pem hauv ntej Plhaub: Stainless hlau, T = 0.20 ± 0.01mm. Back Plhaub: Stainless Hlau, T = 0.20 ± 0.01mm. Clasp: Stainless hlau, T = 0.40 ± 0.01mm. Kev Ua tiav: Kev sib cuag: Kub flashed, ntawm thaj chaw sib cuag. 100u-120u" Tin.Plating, ntawm solder tails. 50u-80u" Nickel, Underplating tshaj tag nrho. Hluav taws xob: Tam sim no ntsuas: 1A Max. Dielectric tiv thaiv Volta...

CONN PLUG MICRO USB HOM B Solder T3.0, L8.8mm KLS1-235-2

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, UL94V-0 LCP, Dub. Hu rau: Copper Alloy C2680. Plhaub: Copper Alloy C2680 / SPCC. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin on Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tam sim no Rating: 1.5A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Kev Tiv Thaiv Kev Tiv Thaiv: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC AT Hiav Txwv Qib. Rwb thaiv tsev Resistance: 1000MΩ Min. Conn...

CONN PLUG MICRO USB HOM B Solder T3.0,L6.8mm KLS1-235-1

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, UL94V-0 LCP, Dub. Hu rau: Copper Alloy C2680. Plhaub: Copper Alloy C2680 / SPCC. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin on Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tam sim no Rating: 1.5A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Kev Tiv Thaiv Kev Tiv Thaiv: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC AT Hiav Txwv Qib. Rwb thaiv tsev Resistance: 1000MΩ Min. Connecto...

CONN PLUG MICRO USB HOM B solder T5.0 KLS1-235-0

Cov ntaub ntawv khoom siv: Lub tsev: LCP + 30% GF Flammability Rating: UL 94V-0 Dub. Plhaub: Stainless hlau. Tiv tauj: tooj dag Contacts Plating Kub Standard: Flash. Hluav taws xob: Tam sim no Rating: 0.5 Amp. Voltage: 100V AC / DC Max. Dielectric Withstanding: 500 V AC rau ib feeb. Kev khiav hauj lwm kub: -55 ° C ~ + 85 ° C Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Sijhawm Order

CONN MICRO USB 5P Solder hom KLS1-4254

Cov ntaub ntawv khoom siv: Lub tsev: Kub Kub Yas, UL94V-0, Dub. Hu rau A: Brass T = 0.20mm, Au Plated. Plhaub: Stainless Hlau T = 0.25mm, Ni Plated. Hluav taws xob: 1.Tam sim no Rating: 1.0A(Signal PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Contact Resistance: 40mΩ Max. 3.Insulation Resistance: 100MΩ Min. 4.Dielectric Withstanding: 100V AC Min. 5.Durability: 10000 cycles. 6.Connector Mating rog: 35N Max (3.57Kgf). 7. Koj...

CONN MICRO USB 5P Clip hom 1.0mm KLS1-4253

Cov ntaub ntawv khoom siv: Cov khoom siv rwb thaiv tsev Thermoplastic. Plhaub: Copper Alloy / SPCC, T = 0.30mm. Plating: Nickel. Terminal: tooj liab alloy, T = 0.25mm. Plating: Kub / Tin Plated. Hluav taws xob: Rwb thaiv tsev Resistance: 1000MΩ Min. Tiv tauj Resistance: 30mΩ Max. Ua hauj lwm voltage: 500V AC. Mechanical Yam ntxwv: Insertion Force: 3.5kgf Max. Extraction quab yuam: 1.02kgf Min. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Sijhawm Order

CONN MICRO USB 5P Clip hom 0.8mm KLS1-4252

Cov ntaub ntawv qhia txog cov khoom: 1.Tam sim no Rating: 1.0A(Signal PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Contact Resistance: 40mΩ Max. 3.Insulation Resistance: 100MΩ Min. 4.Dielectric Withstanding: 100 V AC Min. 5.Durability: 10000 cycles. 6.Connector Mating rog: 35N Max (3.57Kgf). 7.Connector Unmating quab yuam: 8N Min (0.30Kgf). 8.Product Ua Tau Raws Li Qhov Kev Thov ntawm RoHS Tshooj No. Piav Qhia PCS/CTN GW(KG) CMB(m3) OrderQty. Ti...

CONN MICRO USB 2P DIP KLS1-4251

Cov Khoom Siv Cov Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, Dub. Hu rau: Copper Alloy C1591. Plhaub: Copper Alloy C2680 / SPCC. Finish: Sib cuag: Plated Kub Hauv Mating Area; Tin ntawm Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tam sim no Rating: 1.5A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Kev Tiv Thaiv Kev Tiv Thaiv: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 1000MΩ Min. Connector Mate thiab Unmated Force Mate Rau ...

CONN MICRO USB 2P R/A DIP KLS1-4250

Cov Khoom Siv Cov Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, Dub. Hu rau: Copper Alloy C1591. Plhaub: Copper Alloy C2680 / SPCC. Finish: Sib cuag: Plated Kub Hauv Mating Area; Tin ntawm Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tam sim no Rating: 1.5A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Kev Tiv Thaiv Kev Tiv Thaiv: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 1000MΩ Min. Connector Mate thiab Unmated Force Mate Rau ...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4248

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Kub Thermoplastic nrog GF, UL94V-0, Dub. Hu rau: Copper Alloy, t = 0.15mm. Plhaub: Copper Alloy, t = 0.30mm. Hluav taws xob: Tam sim no ntsuas: 1A Max. Dielectric Withstanding Voltage: 100V AC rau 1 min. Tiv tauj Resistance: 50mΩ Max. Rwb thaiv tsev Resistance: 100MΩ Min. Tag nrho Mating Force: 3.57 kgf Max. Tag Nrho Unmating Force: 1.0 kgf Min. Qhov kub thiab txias: -30 ° C mus txog +80 ° C Part No. Descr...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4247

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Kub Thermoplastic nrog GF, UL94V-0, Dub Tiv tauj: tooj liab Alloy, t = 0.20mm. Plhaub: Copper Alloy, t = 0.25mm. Hluav taws xob: Tam sim no ntsuas: 1A Max. Dielectric Withstanding Voltage: 100V AC rau 1 min. Tiv tauj Resistance: 50mΩ Max. Rwb thaiv tsev Resistance: 100MΩ Min. Tag nrho Mating Force: 3.57 kgf Max. Tag Nrho Unmating Force: 1.0 kgf Min. Qhov kub thiab txias: -30 ° C mus txog +80 ° C Part No. Des ...

CONN RCPT 5POS MICRO USB DIP 5.9mm KLS1-4245

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, UL94V-0 LCP, Dub. Hu rau: Copper Alloy C2680. Plhaub: Copper Alloy C2680. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin on Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tam sim no Rating: 1.0A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Kev Tiv Thaiv Kev Tiv Thaiv: 50mΩ Max. Dielectric Withstanding Voltage: 300 V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 100MΩ Min. Txuas ...

CONN RCPT 5POS MICRO USB SMD KLS1-4244

Cov Khoom Siv Khoom Siv Hauv Tsev: Hing Temperature Thermoplastics, UL94V-0 LCP, Dub. Hu rau: Copper Alloy C5191. Plhaub: Copper Alloy C2680. Finish: Hu rau: Plated Kub Hauv Mating Area; Tin on Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Tam sim no Rating: 1.0A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Kev Tiv Thaiv Kev Tiv Thaiv: 50mΩ Max. Dielectric Withstanding Voltage: 300 V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 100MΩ Min. Connector...
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