CONN MICRO USB 2P DIP KLS1-4251
Thov download cov ntaub ntawv PDF:
Product Detail
Khoom cim npe
 | |||
|
| Khoom siv Housing: Hing Temperature Thermoplastics, Dub. Hu rau: Copper Alloy C1591. Plhaub: Copper Alloy C2680 / SPCC. Ua tiav: Kev sib cuag: Plated Kub Hauv Mating Area; Tin ntawm Solder Talls. Plhaub: Nickel Plating. Hluav taws xob: Kev ntsuas tam sim no: 1.5A / Hu rau Terminal. Kev ntsuas hluav taws xob: 30V DC Tiv tauj Resistance: 30mΩ Max. Dielectric Withstanding Voltage: 500 V AC NTAWM Hiav Txwv Qib. Rwb thaiv tsev Resistance: 1000MΩ Min. Connector Mate thiab Unmated Force Mate Force: 3.57kgf Max. Unmated Force: 1.02kgf Min. |
| Tshooj No. | Kev piav qhia | PCS / CTN | GW (KG) | CMB (m3) | OrderQty. | Sijhawm | Kev txiav txim |
