Micro SD 4.0 daim npav txuas laub, H1.3mm KLS1-SD4.0-003
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Product Detail
Khoom cim npe
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Micro SD 4.0 daim npav txuas laub laub, H1.3mm Khoom siv: Insulator: Thermal Yas, Pated UL94V-0. Hu rau: Phosphor Bronze. Plhaub: Stainless hlau. Tiv tauj Plating: Underplate: 50u "-100u" Nickel Hu rau cheeb tsam: Kub Flash Solder tails cheeb tsam: 100u "-200u" Tin Hluav taws xob: Kev khiav hauj lwm voltage: 10V Kev ntsuas tam sim no: 0.5A Min. Tiv tauj Resistance: 100mΩ Max. Rwb thaiv tsev tsis kam: 1000MΩ Dielectric Withstanding Voltage: 500VAC / 1 feeb. Mating Cycles: 3000 insertions |
Tshooj No. | Kev piav qhia | PCS / CTN | GW (KG) | CMB (m3) | OrderQty. | Sijhawm | Kev txiav txim |