CONN MICRO USB 2P R/A DIP KLS1-4250
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Product Detail
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Housing: Hing Temperature Thermoplastics, Dub.
Hu rau: Copper Alloy C1591.
Plhaub: Copper Alloy C2680 / SPCC.
Ua tiav:
Kev sib cuag: Plated Kub Hauv Mating Area; Tin ntawm Solder Talls.
Plhaub: Nickel Plating.
Hluav taws xob:
Kev ntsuas tam sim no: 1.5A / Hu rau Terminal.
Kev ntsuas hluav taws xob: 30V DC
Tiv tauj Resistance: 30mΩ Max.
Dielectric Withstanding Voltage: 500 V AC NTAWM Hiav Txwv Qib.
Rwb thaiv tsev Resistance: 1000MΩ Min.
Connector Mate thiab Unmated Force
Mate Force: 3.57kgf Max.
Unmated Force: 1.02kgf Min.
