Micro SD 4.0 daim npav txuas laub, H1.3mm KLS1-SD4.0-003
Cov duab khoom
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Cov ntaub ntawv khoom
Micro SD 4.0 daim npav txuas laub laub, H1.3mm
Khoom siv:
Insulator: Thermal Yas, Pated UL94V-0.
Hu rau: Phosphor Bronze.
Plhaub: Stainless hlau.
Tiv tauj Plating:
Underplate: 50u”-100u” Nickel
Underplate: 50u”-100u” Nickel
Hu rau cheeb tsam: Kub Flash
Solder tails cheeb tsam: 100u"-200u" Tin
Hluav taws xob:
Kev khiav hauj lwm voltage: 10V
Kev ntsuas tam sim no: 0.5A Min.
Tiv tauj Resistance: 100mΩ Max.
Rwb thaiv tsev Resistance: 1000MΩ
Dielectric Withstanding Voltage: 500VAC / 1 feeb.
Mating Cycles: 3000 insertions
Sau koj cov lus ntawm no thiab xa tuaj rau peb
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