Cov duab khoom
Cov ntaub ntawv khoom
Khoom siv
Lub tsev: Hing Temperature Thermoplastic, UL94V-0 LCP, Dub.
Hu rau: Copper Alloy C2680.
Plhaub: Copper Alloy C2680 / SPCC.
Ua tiav:
Hu rau: Piated Kub Hauv Mating Area; Tin ntawm Solder Talls.
Plhaub: Nickel Plating.
Hluav taws xob:
Kev ntsuas tam sim no: 1.0A / Hu rau Terminal.
Kev ntsuas hluav taws xob: 30V DC
Tiv tauj Resistance: 50mΩ Max.
Dielectric Withstanding Voltage: 300 V AC NTAWM Hiav Txwv Qib.
Rwb thaiv tsev Resistance: 100MΩ Min.
Connector Mate thiab Unmated Force
Mate Force: 3.0kgf Max.
Unmated Force: 0.7kgf Min.
Terminal Retenion: 0.
Yav dhau los: HONGFA Loj 29.0 × 12.7 × 15.7mm KLS19-HF158F Tom ntej: 5P B hom R/A SMD Mini USB socket KLS1-229-5FD