KLS1-NGFF01-4.0-A-G1U

Qhov siab: 4.0mm
Hom: A, B, E, M
Kub Plating: G1U-Gold 1u" G3U-Gold 3u" G30U-Gold 30u"

1: Tsim los rau ob qho tib si-thiab ob sab modules
2: Muaj nyob rau hauv ntau yam kev xaiv keying rau module phaib

3: Txhawb PCI Express 3.0, USB 3.0, thiab SATA 3.0

4: Xaiv qhov siab, txoj hauj lwm, tsim, thiab kev xaiv keying

5: Muaj nyob rau hauv ntau qhov siab

Khoom Specification:

Housing: LCP + 30% GF UL94 V-0.Black

Hu rau: Copper Alloy (C5210) T = 0.12mm.

Leg: Copper Alloy (C2680) T = 0.20mm.

Hu rau: saib P/N.

ceg: Matte Tin 50μ "min. zuag qhia tag nrho, Nickel 50μ" min. underplated.

Insertion quab yuam: 20N max.

Kev tawm dag zog: 20N max.

Durability: 60 cycles min.

Kev vibration: Tsis muaj hluav taws xob cuam tshuam ntau dua 1u thib ob. yuav tshwm sim;

Mechanical shock: 285G ib nrab sine / 6 axis. tsis muaj hluav taws xob cuam tshuam ntau dua 1u thib ob yuav tsum tshwm sim;

Kev ntsuas tam sim no: 0.5A (ib tus pin).

Kev ntsuas hluav taws xob: 50V AC (ib tus pin).

LLCR: Hu rau 55mΩ max.(initial), 20mΩ max. hloov pauv tau (kawg).

Rwb thaiv tsev Resistance: 5,000MΩ min. ntawm 500V DC.

Dielectric tiv thaiv voltage: 300V AC / 60s.

IR Reflow:

Lub ncov kub ntawm lub nkoj yuav tsum tau khaws cia rau 10 vib nas this ntawm 260 ± 5 ° C.

Kev khiav hauj lwm kub: -40 ° C ~ 85 ° C (tsis muaj kev poob haujlwm).

Tag nrho cov khoom RoHS thiab Reach raws.