Cov ntaub ntawv xaj
KLS1-NGFF01-3.2-67-B-G0

Plating: 1u" ~ 30u "GoldG1U-Gold 1u" G3U-Gold 3u"G30U-Gold30u"

• 0.5mm suab nrog 67 txoj haujlwm
• Tsim los rau ob qho tib si-thiab ob sab modules
• Muaj nyob rau hauv ntau yam kev xaiv keying rau module phaib
• Txhawb PCI Express 3.0, USB 3.0, thiab SATA 3.0
• Kev xaiv nyob rau hauv qhov siab, txoj hauj lwm, tsim, thiab kev xaiv keying
• Muaj nyob rau hauv ntau qhov siab
  
• Material Specification:
• Housing: LCP + 30% GF UL94 V-0.
• Hu rau: Copper Alloy (C5210) T = 0.12mm.
• Leg: Copper Alloy (C2680) T = 0.20mm.
• Plating Specification:
• Hu rau: saib P/N.
• Leg: Matte Tin 50μ" min. zuag qhia tag nrho, Nickel 50μ" min. underplated.
• Mechanical Performance:
• Insertion quab yuam: 20N max.
• Kev tawm dag zog: 20N max.
• Durability: 60 cycles min.
• Kev vibration: Tsis muaj hluav taws xob cuam tshuam ntau dua 1u thib ob. yuav tshwm sim;
• Mechanical shock: 285G ib nrab sine / 6 axis. tsis muaj hluav taws xob discontinuity ntau dua 1u thib ob yuav tsum tshwm sim;
• Hluav taws xob Performance:
• Kev ntsuas tam sim no: 0.5A (ib tus pin).
• Kev ntsuas hluav taws xob: 50V AC (ib tus pin).
• LLCR: Hu rau 55m? max.(initial), 20m? max. hloov pauv tau (kawg).
• Rwb thaiv tsev Resistance: 5,000M? min. ntawm 500V DC.
• Dielectric tiv thaiv voltage: 300V AC / 60s.
• IR Reflow:
  Lub ncov kub ntawm lub nkoj yuav tsum tau khaws cia rau 10 vib nas this ntawm 260 ± 5 ° C.
  Kev khiav hauj lwm kub: -40 ° C ~ 85 ° C (tsis muaj kev poob haujlwm).
  Tag nrho cov khoom RoHS thiab Reach raws.